An independent subcontractor for semiconductor assembly, test and packaging services.
CONTACT:
116 East Main Avenue, Phase V, SEZ
Laguna Technopark, Binan, Laguna
Philippines 4024
Tel. ......
Semiconductor assembly and packaging services, including quick turn and turn key projects for mil-std, BGA, folded flex, and multichip packages. ......
Assembly and testing services for sensor, wireless, and automotive semiconductors. Facilities in Asia, Europe, and USA. Site lists capabilities including ......
Provides high density interconnect (HDI) substrates and flip chip semiconductor BGA packaging for single or multichip (MCM) modules. Packaging description, ......
Custom and standard silicon photodetectors and thick and thin film optoelectronic devices, offering wafer fabrication, bonding and packaging, and testing.
Supplying custom coatings and patterned substrates to customers involved with microelectronics with information on coatings, patterning, capabilities, manufacturing and contacts.