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Cirtek Electronics Corporation: An independent subcontractor for semiconductor assembly, test and packaging services.
CONTACT:
116 East Main Avenue, Phase V, SEZ
Laguna Technopark, Binan, Laguna
Philippines 4024
Tel.
Chartered Semiconductor Manufacturing: Dedicated integrated circuit (IC) wafer foundry
CONTACT:
60 Woodlands Industrial Park D
Street Two, Singapore 738406
Tel: (65) 6362.2838
Fax: (65) 6362.2938
Catalyst Microtech LLC: Semiconductor assembly and packaging services, including quick turn and turn key projects for mil-std, BGA, folded flex, and multichip packages.
ASE Korea, Inc.: Assembly and testing services for sensor, wireless, and automotive semiconductors. Facilities in Asia, Europe, and USA. Site lists capabilities including
Ampac Enterprises, Inc.: Offering assembly services for plastic IC packaging and full box build contract manufacturing.
Amitec: Provides high density interconnect (HDI) substrates and flip chip semiconductor BGA packaging for single or multichip (MCM) modules. Packaging description,
AME AS: Custom and standard silicon photodetectors and thick and thin film optoelectronic devices, offering wafer fabrication, bonding and packaging, and testing.
Advanced Thin Film Technology: Provides high quality thin film coatings, patterned substrates, hybrid and resistor networks.
CONTACT:
Telephone: (845) 790-5169
Voice/Pager: (845) 486-7350
Toll
Advanced Thin Film Technologies: Supplying custom coatings and patterned substrates to customers involved with microelectronics with information on coatings, patterning, capabilities, manufacturing and contacts.
1st Silicon : Semiconductor foundry founded in 1998 by the Malaysian State of Sarawak. 0.18 and 0.25 micron CMOS and mixed signal CMOS
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