CoorsTek, a large technical ceramics manufacturer and long-time provider of electronic components, today introduced its new DuraStrate thick-film ceramic substrates. Developed specifically for improved performance in thick-film substrates, this new material offers significant performance advantages over standard, widely-available ceramic substrates.

Specifically, CoorsTek is employing a finer-grain (1.5 to 2.0 micron) microstructure material -- chiefly responsible for a 20% increase in biaxial flexural strength over traditional materials, improved thick-film performance, consistent thicknesses, improved camber flatness, and better aged adhesion. This enhanced durability should translate to improved process yields, longer product life, and superior reliability. CoorsTek currently offers the DuraState ceramic for only the very thin (10-15 mil) varieties of thick-film substrates.

"As the industry moves toward increased miniaturization, higher-power applications, and begins to demand longer-term reliability, they will need a more durable and reliable thick-film ceramic substrate," states Lee Harder, Vice President of CoorsTek. "We developed and fine-tuned the DuraStrate material specifically for these needs and expect to make a significant impact in the industry," he continued.


More about CoorsTek...

Established in 1910, CoorsTek is one of the largest technical ceramics manufacturers in the world and serves customers throughout North America, Europe, and Asia from 17 state-of-the-art facilities around the globe. CoorsTek supplies critical components and complete assemblies for electronic, medical, automotive, semiconductor, aerospace, energy, telecommunication, and other high-technology applications. Utilizing advanced material technologies, the company's engineered solutions enable its customers' products to overcome technological barriers and improve performance.