ASAT Holdings Limited (Nasdaq: ASTT), a global provider of semiconductor package design, assembly and test services, today announced the appointment of Gabby Ang as vice president of North American sales, effective immediately. Mr. Ang will be based in Milpitas, Calif., and report to Joe Martin, executive vice president of sales and marketing of ASAT Holdings.

Mr. Ang brings nearly 30 years of senior level sales experience in the assembly and test industry to ASAT Holdings. From 2004 to 2006, Mr. Ang served as vice president of sales for Advanced Semiconductor Engineering (ASE). He held a similar position with ASE from 1986 to 1991. Prior to his most recent employment with ASE, Mr. Ang served in key sales positions at Advanced Interconnect Technologies between 1991 and 2004, most recently as executive vice president of worldwide sales. Mr. Ang has also worked in sales positions with Amkor and Interlek/Dynamics.

"Gabby has a successful record of increasing market share and effectively managing large accounts during his long career in the semiconductor assembly and test industry and I am confident he will have an immediate and positive impact on our North American sales efforts," said Tung Lok Li, acting CEO of ASAT Holdings Limited.

"The recent move of all manufacturing to China opens several opportunities for the Company to add new clients and expand sales to its extensive customer base," said Mr. Ang. "I look forward to leveraging my experience and contacts in the semiconductor assembly and test industry to drive the Company's future sales."

Mr. Ang holds a Master's in International Management from the American Graduate School of International Management, and a Bachelor's of Science in Mechanical Engineering from Tri-State University.

About ASAT Holdings Limited

ASAT Holdings Limited is a global provider of semiconductor package design, assembly and test services. With 18 years of experience, the Company offers a definitive selection of semiconductor packages and world-class manufacturing lines. ASAT's advanced package portfolio includes standard and high thermal performance ball grid arrays, leadless plastic chip carriers, thin array plastic packages, system-in-package and flip chip. ASAT was the first company to develop moisture sensitive level one capability on standard leaded products. Today the Company has operations in the United States, Asia and Europe.