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Arizona Inventor Develops Silicon Wafer Mechanical Planarizing Apparatus
4th August, 2006

Clinton O. Fruitman of Chandler, Ariz., has developed methods and an apparatus for the chemical mechanical planarization of electronic devices.

According to the U.S. Patent & Trademark Office, the invention relates to "method and apparatus for chemically and mechanically planarizing the surface of a silicon wafer which includes a compressible non-cellualar lapping surface and a slurry disposed between the wafer and the lapping surface."

The inventor was issued U.S. Patent No. 7,083,501 on Aug. 1.

The patent has been assigned to SpeedFam-IPEC Corp., Chandler.

The original application was filed on Jan. 16, 1998, and is available at: .

For more information about US Fed News federal patent awards please contact: Myron Struck, Managing Editor/US Bureau, US Fed News, Direct: 703/866-4708, Cell: 703/304-1897, .

Release link:  http://www.reed-electronics.com/
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