| || Arizona Inventor Develops Silicon Wafer Mechanical Planarizing Apparatus |
4th August, 2006
Clinton O. Fruitman of Chandler, Ariz., has developed methods and an apparatus for the chemical mechanical planarization of electronic devices. Release link: http://www.reed-electronics.com/
According to the U.S. Patent & Trademark Office, the invention relates to "method and apparatus for chemically and mechanically planarizing the surface of a silicon wafer which includes a compressible non-cellualar lapping surface and a slurry disposed between the wafer and the lapping surface."
The inventor was issued U.S. Patent No. 7,083,501 on Aug. 1.
The patent has been assigned to SpeedFam-IPEC Corp., Chandler.
The original application was filed on Jan. 16, 1998, and is available at: .
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